• Cleanroom Facilities

    800  m² of fully CMOS compatible cleanroom facilities plus a cleanroom-like process development lab
    - Cleanroom 100 (Front-end of line)

    - Cleanroom 300
    - X-Lab
  • Growth, Synthesis and Deposition

    - Atomic Layer Deposition (ALD)
    - Chemical Vapour Deposition (CVD)
    - Molecular Beam Epitaxy (MBE)
    - Metal-Organic Chemical Vapour Deposition (MOCVD)
    - Plasma-Enhanced Chemical Vapour Deposition (PECVD)
    - Sputter Deposition
    - Thermal Evaporation
    - 2D-Material Stacking Station
  • Materials Characterization

    - Auger Electron Spectroscopy (AES)
    - Atomic Force Microscopy (AFM)
    - Electron BackScatter Diffraction (EBSD)
    - Energy-Dispersive X-ray Spectroscopy (EDX)
    - Ellipsometry
    - Fourier-Transform Infrared Spectroscopy (FT-IR)
    - Low-Energy Electron Diffraction (LEED)
    - Nano -Infrared Spectroscopy (NanoIR / AFM / s-SNOM)
    - Optical Microscopy
    - Profilometry
    - Raman (Confocal Raman / PL)
    - Reflectometry
    - Scattering Scanning Near-Field Optical Microscopy (s-SNOM)
    - Scanning Electron Microscopy (SEM)
    - Magnetic Sector-Field Secondary Ion Mass Spectrometry (SIMS)
    - Timo-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)
    - UV-Vis-Spectroscopy
    - X-ray Photoelectron Spectroscopy (XPS / ESCA)
  • Devices Characterization

    - Electrical Characterization
    - Gas Sensor Characterization
    - Wire Bonding