Thanks to the support of our university, partners and funding agencies a modern and diverse infrastructure is available to ensure the effective handling of research topics.



400 m² of fully CMOS compatible cleanroom facilities, class 100, certified
  • Cleanroom 300 (Back-end of line BEOL)

400 m2 of fully CMOS compatible cleanroom facilities and special processes, class 100

  • X-Lab

cleanroom-like process development lab

  • Electrical Characterization Lab

with wire bonding, manual, semiautomated and vacuum probe stations and low temperature electrical transport

  • Gas Sensing Lab

with various sets-up for environmental and toxic gases

  • Dedicated Surface Analysis Lab

with vibration free environment

  • Dedicated 2D Materials Deposition Lab

with a range of CVD, MOCVD, ALD tools

  • Chemistry Lab

for wet-chemistry and surface treatments


Growth, Synthesis and Deposition

- Atomic Layer Deposition (ALD)
- Chemical Vapour Deposition (CVD)
- Molecular Beam Epitaxy (MBE)
- Metal-Organic Chemical Vapour Deposition (MOCVD)
- Plasma-Enhanced Chemical Vapour Deposition (PECVD)
- Sputter Deposition
- Thermal Evaporation
- 2D-Material Stacking Station

Materials Characterization

- Auger Electron Spectroscopy (AES)
- Atomic Force Microscopy (AFM)
- Electron BackScatter Diffraction (EBSD)
- Energy-Dispersive X-ray Spectroscopy (EDX)
- Ellipsometry
- Fourier-Transform Infrared Spectroscopy (FT-IR)
- Low-Energy Electron Diffraction (LEED)
- Nano -Infrared Spectroscopy (NanoIR / AFM / s-SNOM)
- Optical Microscopy
- Profilometry
- Raman (Confocal Raman / PL)
- Reflectometry
- Scattering Scanning Near-Field Optical Microscopy (s-SNOM)
- Scanning Electron Microscopy (SEM)
- Magnetic Sector-Field Secondary Ion Mass Spectrometry (SIMS)
- Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)
- UV-Vis-Spectroscopy
- X-ray Photoelectron Spectroscopy (XPS / ESCA)

Devices Characterization

- Electrical Characterization
- Gas Sensor Characterization
- Wire Bonding